M. Murugesan

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Murugesan, Hisashi Kino, Hiroshi Nohira et al. · 2010 · 81 citations

Engineering, Materials Engineering, Materials Science +17

New heterogeneous multi-chip module integration technology using self-assembly method

Takafumi Fukushima, Toshihiro Konno, K. Kiyoyama et al. · 2008 · 54 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation

Takafumi Fukushima, Eiji Iwata, Yuki Ohara et al. · IEEE Transactions on Electron Devices · 2012 · 47 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16

Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

Takafumi Fukushima, J. C. Bea, Hisashi Kino et al. · IEEE Transactions on Electron Devices · 2014 · 45 citations

Engineering, Manufacturing Engineering, Microelectromechanical Systems +12

High density 3D LSI technology using W/Cu hybrid TSVs

M. Murugesan, Hisashi Kino, A. Hashiguchi et al. · 2011 · 44 citations

Engineering, Electrical Engineering, Materials Science +17