T. Nakamura

Advantages of thermal nitride and nitroxide gate films in VLSI process

Takashi Ito, T. Nakamura, Hajime Ishikawa · IEEE Transactions on Electron Devices · 1982 · 232 citations

Engineering, Vlsi Process, Thermal Nitridation +20

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

Mitsumasa Koyanagi, T. Nakamura, Yusuke Yamada et al. · IEEE Transactions on Electron Devices · 2006 · 220 citations

Engineering, Computer Architecture, Integration Technology +18

Three-dimensional shared memory fabricated using wafer stacking technology

K.W. Lee, T. Nakamura, Takahito Ono et al. · 2002 · 140 citations

Engineering, Computer Architecture, Integration Technology +16

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +7

Intelligent image sensor chip with three dimensional structure

H. Kurino, K.W. Lee, T. Nakamura et al. · 2003 · 87 citations

Engineering, Device Integration, Integration Technology +21