Concepedia

Takayuki Ohba

TO

45

Publications

1.2K

Citations

19

H-Index

1987

Active since

Affiliations

Fujitsu (Japan)(Current)

The University of Tokyo

Tokyo Institute of Technology

Dai Nippon Printing (Japan)

Takayuki Ohba is an author at Fujitsu (Japan) specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringApplied PhysicsMaterial ScienceMicrofabrication3D PrintingIntegrated Circuits3D Integration

Publications per year

1987–2022

45

Publications

45

Cu Wettability and Diffusion Barrier Property of Ru Thin Film for Cu Metallization

Hoon Kim, Toshihiko Koseki, Takayuki Ohba et al. · Journal of The Electrochemical Society · 2005 · 150 citations

Materials Science, Electromigration Technique, Engineering +14

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +7

Advanced wafer thinning technology and feasibility test for 3D integration

Young Seok Kim, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2013 · 84 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +10

Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements

Yusuke Kitaoka, Takeshi Tono, Shinya Yoshimoto et al. · Applied Physics Letters · 2009 · 59 citations

Engineering, Microscopy, Direct Detection +22

Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration

Yoriko Mizushima, Young-Suk Kim, T. Nakamura et al. · Japanese Journal of Applied Physics · 2014 · 46 citations

Engineering, Mechanical Engineering, Surface Integrity +22

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