Publication | Closed Access
Advanced wafer thinning technology and feasibility test for 3D integration
84
Citations
7
References
2013
Year
3D Ic ArchitectureWafer Scale ProcessingEngineeringDevice IntegrationAdvanced Packaging (Semiconductors)MicrofabricationMechanical EngineeringFeasibility Test3D PrintingElectronic PackagingMicroelectronics3D IntegrationInterconnect (Integrated Circuits)
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|---|---|---|
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