Advanced wafer thinning technology and feasibility test for 3D integration

A 90-nm logic technology featuring strained-silicon

Scott E. Thompson, M Armstrong, C. Auth et al. · IEEE Transactions on Electron Devices · 2004 · 666 citations

Engineering, Electrical Engineering, Materials Science +17

Future system-on-silicon LSI chips

Mitsumasa Koyanagi, H. Kurino, Kang Wook Lee et al. · IEEE Micro · 1998 · 336 citations

Engineering, Computer Engineering, Electrical Engineering +17

One-gate-wide CMOS Inverter on laser-recrystallized polysilicon

J.F. Gibbons, K.F. Lee · IEEE Electron Device Letters · 1980 · 124 citations

Engineering, Electrical Engineering, Electronic Materials +13

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

Natural Sciences, Manufacturing Engineering, Materials Science +12

Three-dimensional CMOS IC's Fabricated by using beam recrystallization

S. Kawamura, N. Sasaki, T. Iwai et al. · IEEE Electron Device Letters · 1983 · 74 citations

Engineering, Computer Engineering, Electrical Engineering +17