Concepedia

Nobuhide Maeda

NM

Statistics

Publications

6

Citations

254

H-Index

6

Active since

2009

Affiliations

The University of Tokyo(Current)

Fujitsu (Japan)

Dai Nippon Printing (Japan)

Bunkyo University

Nobuhide Maeda is an author at The University of Tokyo specializing in engineering, semiconductor devices, and materials science.

Publications per year

2009–2015

6

Publications

6

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

Natural Sciences, Manufacturing Engineering, Materials Science +12

Advanced wafer thinning technology and feasibility test for 3D integration

Young Seok Kim, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2013 · 89 citations

Engineering, Manufacturing Engineering, Materials Science +11

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Hideki Kitada, Nobuhide Maeda, Koji Fujimoto et al. · Japanese Journal of Applied Physics · 2011 · 26 citations

Engineering, Electrical Engineering, Materials Science +17

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima et al. · IEICE Electronics Express · 2015 · 22 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +16

TSV (through silicon via) interconnection on wafer-on-a-wafer (WOW) with MEMS technology

Koji Fujimoto, Nobuhide Maeda, Hideki Kitada et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 12 citations

Engineering, Electrical Engineering, Materials Science +17

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