Nobuhide Maeda

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +7

Advanced wafer thinning technology and feasibility test for 3D integration

Young Seok Kim, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2013 · 84 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +10

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Hideki Kitada, Nobuhide Maeda, Koji Fujimoto et al. · Japanese Journal of Applied Physics · 2011 · 26 citations

Engineering, Thin Film Process Technology, Silicon On Insulator +17

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima et al. · IEICE Electronics Express · 2015 · 22 citations · Full text

Engineering, Device Integration, Integrated Circuits +23

TSV (through silicon via) interconnection on wafer-on-a-wafer (WOW) with MEMS technology

Koji Fujimoto, Nobuhide Maeda, Hideki Kitada et al. · TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference · 2009 · 12 citations

Engineering, Device Integration, Integrated Circuits +19