Concepedia

Yoriko Mizushima

YM

Statistics

Publications

10

Citations

188

H-Index

10

Active since

1991

Affiliations

Fujitsu (Japan)(Current)

The University of Tokyo

Tokyo Institute of Technology

University of Tsukuba

Yoriko Mizushima is an author at Fujitsu (Japan) specializing in engineering, semiconductor devices, and materials science.

Publications per year

1991–2016

10

Publications

10

Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration

Yoriko Mizushima, Young-Suk Kim, T. Nakamura et al. · Japanese Journal of Applied Physics · 2014 · 48 citations

Engineering, Materials Engineering, Materials Science +15

Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Hideki Kitada, Nobuhide Maeda, Koji Fujimoto et al. · Japanese Journal of Applied Physics · 2011 · 26 citations

Engineering, Electrical Engineering, Materials Science +17

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima et al. · IEICE Electronics Express · 2015 · 22 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +16

Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure

Yoriko Mizushima, Young-Suk Kim, T. Nakamura et al. · Microelectronic Engineering · 2016 · 21 citations

Engineering, Materials Engineering, Materials Science +15

Simple Modeling and Characterization of Stress Migration Phenomena in Cu Interconnects

H. Tsuchikawa, Yoriko Mizushima, T. Nakamura et al. · Japanese Journal of Applied Physics · 2006 · 15 citations

Engineering, Electrical Engineering, Materials Engineering +17

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