Kousuke Suzuki

Thinned wafer multi-stack 3DI technology

Takayuki Ohba, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2009 · 94 citations

Natural Sciences, Manufacturing Engineering, Materials Science +12

Advanced wafer thinning technology and feasibility test for 3D integration

Young Seok Kim, Nobuhide Maeda, Hideki Kitada et al. · Microelectronic Engineering · 2013 · 89 citations

Engineering, Manufacturing Engineering, Materials Science +11

Development of multi-wheeled snake-like rescue robots with active elastic trunk

Kousuke Suzuki, Atsushi Nakano, Gen Endo et al. · 2012 · 26 citations · Full text

Engineering, Mechanical Engineering, Robotics Engineering +17

Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

Seiichi Yoshimi, Koji Fujimoto, Miyuki Akazawa et al. · 2013 · 13 citations

Engineering, Computer Engineering, Electrical Engineering +17

Cost effective interposer for advanced electronic packages

Satoru Kuramochi, Sumio Koiwa, Kousuke Suzuki et al. · 2014 · 11 citations

Engineering, Electrical Engineering, Materials Science +17