Concepedia

Seiichi Yoshimi

SY

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Publications

2

Citations

24

H-Index

2

Active since

2013

Affiliations

Fujitsu (Japan)(Current)

Seiichi Yoshimi is an author at Fujitsu (Japan) specializing in microfabrication, advanced packaging, and engineering.

Top concepts

Publications per year

2013–2013

2

Publications

2

Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

Seiichi Yoshimi, Koji Fujimoto, Miyuki Akazawa et al. · 2013 · 13 citations

, , +19

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Yoriko Mizushima, Hideki Kitada, Chihiro J. Uchibori et al. · Japanese Journal of Applied Physics · 2013 · 11 citations

, , +21

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