Miyuki Akazawa

Electroless and Electrolytic Copper Plating of Glass Interposer Combined with Metal Oxide Adhesion Layer for Manufacturing 3D RF Devices

Zhiming Liu, Hailuo Fu, Sara Hunegnaw et al. · 2016 · 21 citations

Rf Devices, Glass Interposer Combined, Engineering +20

Demonstration of high electromigration resistance of enhanced sub-2 micron-scale Cu redistribution layer for advanced fine-pitch packaging

Hiroshi Kudo, Ryohei Kasai, Jyunichi Suyama et al. · 2017 · 21 citations

Engineering, Redistribution Layer Structure, Advanced Packaging (Semiconductors) +19

High-density packaging technologies on silicon substrates

Miyuki Akazawa, Satoru Kuramochi, Tomoko Tomoko et al. · 2004 · 16 citations

Materials Science, Chip-scale Package, Engineering +8

Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Takamasa Takano, Hiroshi Kudo, Masaya Tanaka et al. · 2019 · 15 citations

Engineering, Pattern Transfer, Integrated Circuits +24

Development of 300 mm TSV interposer with redistribution layers on both sides using MEMS processes

Seiichi Yoshimi, Koji Fujimoto, Miyuki Akazawa et al. · 2013 · 13 citations

Engineering, Integrated Circuits, Redistribution Layers +19