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Takamasa Takano

TT

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Publications

3

Citations

43

H-Index

3

Active since

2019

Affiliations

Dai Nippon Printing (Japan)(Current)

Takamasa Takano is an author at Dai Nippon Printing (Japan) specializing in electrical engineering, microelectronics, and applied physics.

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Publications per year

2019–2022

3

Publications

3

Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration

Hiroshi Kudo, Takamasa Takano, Masaya Tanaka et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations

, , +20

Submicron-Scale Cu RDL Pattering Based on Semi-Additive Process for Heterogeneous Integration

Takamasa Takano, Hiroshi Kudo, Masaya Tanaka et al. · 2019 · 15 citations

, , +24

High-speed, High-density, and Highly-manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Systems

Hiroshi Kudo, Takamasa Takano, Miyuki Akazawa et al. · 2021 · 12 citations

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