2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

3D Packaging for Heterogeneous Integration

Rahul Agarwal, Patrick Cheng, Priyal Shah et al. · 2022 · 118 citations

Engineering, Computer Engineering, High-performance Computing +17

Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

Yoshihisa Kagawa, Takumi Kamibayashi, YURIKO YAMANO et al. · 2022 · 66 citations

Engineering, Manufacturing Engineering, Materials Science +14

Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration

Anne Jourdain, Michele Stucchi, Geert Van der Plas et al. · 2022 · 45 citations

Engineering, Computer Engineering, Electrical Engineering +17

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Laura Mirkarimi, Cyprian Uzoh, Dominik Suwito et al. · 2022 · 41 citations

Engineering, Materials Engineering, Materials Science +17

Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

Toshiaki Shirasaka, Tadashi Okuda, Tomoaki Shibata et al. · 2022 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14