Statistics
Publications
26
Citations
1.3K
H-Index
18
Active since
2000
Laura Mirkarimi is an author at Xperi (United States) specializing in engineering, electronic materials, and integrated circuit design.
Publications per year
2000–2023
26
26
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations
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