Guilian Gao

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 62 citations

Engineering, High Throughput, Integrated Circuits +16

A quantum chemical study of ZrO2 atomic layer deposition growth reactions on the SiO2 surface

Joseph H. Han, Guilian Gao, Yuniarto Widjaja et al. · Surface Science · 2003 · 48 citations

Materials Science, Ii-vi Semiconductor, Chemical Engineering +10

Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits

Akash Agrawal, Shaowu Huang, Guilian Gao et al. · 2017 · 46 citations

Engineering, Device Integration, Electrical Performance +23

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect

Jeremy Theil, Laura Mirkarimi, G. G. Fountain et al. · 2019 · 37 citations

Engineering, Computer Architecture, Bond Wafers +21