Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman, +10

EngineeringHigh ThroughputIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale Processing +14

A quantum chemical study of ZrO2 atomic layer deposition growth reactions on the SiO2 surface

Joseph H. Han, Guilian Gao, Yuniarto Widjaja, +2

Surface Science

Materials ScienceIi-vi SemiconductorChemical EngineeringEngineeringNanotechnology +8

Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits

Akash Agrawal, Shaowu Huang, Guilian Gao, +3

EngineeringDevice IntegrationElectrical PerformanceIntegrated CircuitsThermo-compression Bonding +21

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh, +8

Materials ScienceMaterials EngineeringElectrical EngineeringDbi UltraEngineering +12

Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect

Jeremy Theil, Laura Mirkarimi, G. G. Fountain, +2

EngineeringComputer ArchitectureBond WafersIntegrated CircuitsTest Vehicle +19

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Laura Mirkarimi, Cyprian Uzoh, Dominik Suwito, +8

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

EngineeringMechanical EngineeringCu MicrostructureThermal ConductivityAdvanced Packaging (Semiconductors) +25

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao, Laura Mirkarimi, G. G. Fountain, +7

EngineeringFull Daisy ChainComputer ArchitectureIntegrated CircuitsBonding Pitch +17

Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

Guilian Gao, Laura Mirkarimi, Thomas Workman, +8

EngineeringReliability AssessmentHigh ThroughputDiameter Bond PadsIntegrated Circuits +18

Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study

Guilian Gao, P. Mrozek, Thomas Workman, +7

Materials ScienceWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Microfabrication +12

Die to Wafer Hybrid Bonding and Fine Pitch Considerations

Thomas Workman, Laura Mirkarimi, Jeremy Theil, +7

Advanced PackagingElectrical EngineeringChip-scale PackageEngineeringHybrid Bonding +12