Thomas Workman

Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 62 citations

Engineering, High Throughput, Integrated Circuits +16

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations

Materials Science, Materials Engineering, Electrical Engineering +14

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Laura Mirkarimi, Cyprian Uzoh, Dominik Suwito et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 37 citations

Engineering, Mechanical Engineering, Cu Microstructure +27

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 35 citations

Engineering, Full Daisy Chain, Computer Architecture +19

Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment

Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2018 · 30 citations

Engineering, Reliability Assessment, High Throughput +20