Statistics
Publications
12
Citations
347
H-Index
11
Active since
2018
Affiliations
Xperi (United States)(Current)
Thomas Workman is an author at Xperi (United States) specializing in engineering, die-to-wafer bonding, and wafer bonding.
Publications per year
2018–2023
12
12
Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding
Guilian Gao, Laura Mirkarimi, Thomas Workman et al. · 2019 · 63 citations
Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
Guilian Gao, Laura Mirkarimi, G. G. Fountain et al. · 2018 · 39 citations
Engineering, Manufacturing Engineering, Microfabrication +16
Die to Wafer Stacking with Low Temperature Hybrid Bonding
Guilian Gao, Thomas Workman, Cyprian Uzoh et al. · 2020 · 39 citations
Engineering, Manufacturing Engineering, Materials Science +17
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