Cyprian Uzoh

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Chemical Deposition, Interconnect (Integrated Circuits) +18

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 350 citations

3D Ic Architecture, Electrical Engineering, Cu Wiring +8

Copper interconnection integration and reliability

C.‐K. Hu, B. M. Luther, F. B. Kaufman et al. · Thin Solid Films · 1995 · 222 citations

Reliability, Copper Interconnection Integration, Electrical Engineering +8

A high performance liner for copper damascene interconnects

D. Edelstein, Cyprian Uzoh, C. Cabral et al. · 2001 · 90 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +13

Materials Issues in Copper Interconnections

J. M. E. Harper, E. G. Colgan, C-K. Hu et al. · MRS Bulletin · 1994 · 78 citations

Materials Engineering, Materials Science, Electromigration Technique +5