Concepedia

John Dukovic

JD

Statistics

Publications

14

Citations

2.4K

H-Index

14

Active since

1987

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

Applied Materials (United States)

Columbia University

IBM (United States)

University of California, Berkeley

John Dukovic is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, microelectronics, and electrochemistry.

Top concepts

EngineeringMicroelectronicsElectrochemistryMicrofabricationElectrical EngineeringApplied PhysicsMaterial ScienceElectronic PackagingElectrical InsulationSurface Science

Publications per year

1987–2012

14

Publications

14

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Chemical Deposition, Interconnect (Integrated Circuits) +18

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 350 citations

3D Ic Architecture, Electrical Engineering, Cu Wiring +8

The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas‐Evolving Electrodes

John Dukovic, Charles W. Tobias · Journal of The Electrochemical Society · 1987 · 222 citations

Attached Bubbles, Electrical Engineering, Chemical Engineering +15

Electrodeposition of Nickel‐Iron Alloys: I . Effect of Agitation

P. C. Andricacos, C. Arana, J. Tabib et al. · Journal of The Electrochemical Society · 1989 · 106 citations

Materials Science, Electrode Surface, Magnetic Properties +13

The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition

S. Mehdizadeh, John Dukovic, P. C. Andricacos et al. · Journal of The Electrochemical Society · 1992 · 91 citations

Engineering, Electron-beam Lithography, Mechanical Engineering +23

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