John Dukovic

Statistics

Publications

Citations

2.4K

H-Index

Active since

1987

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

Applied Materials (United States)

Columbia University

IBM (United States)

University of California, Berkeley

John Dukovic is an author at IBM Research - Thomas J. Watson Research Center specializing in materials science, engineering, and current distribution.

Publications per year

1987–2012

Publications

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Materials Engineering, Materials Science +16

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

Engineering, Computer Engineering, Electrical Engineering +17

The Influence of Attached Bubbles on Potential Drop and Current Distribution at Gas‐Evolving Electrodes

John Dukovic, Charles W. Tobias · Journal of The Electrochemical Society · 1987 · 229 citations

Natural Sciences, Chemical Engineering, Chemistry +17

Electrodeposition of Nickel‐Iron Alloys: I . Effect of Agitation

P. C. Andricacos, C. Arana, J. Tabib et al. · Journal of The Electrochemical Society · 1989 · 106 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition

S. Mehdizadeh, John Dukovic, P. C. Andricacos et al. · Journal of The Electrochemical Society · 1992 · 93 citations

Engineering, Materials Engineering, Materials Science +17

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