P. C. Andricacos

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Chemical Deposition, Interconnect (Integrated Circuits) +18

The chemistry of additives in damascene copper plating

Philippe M. Vereecken, Robert A. Binstead, Hariklia Deligianni et al. · IBM Journal of Research and Development · 2005 · 444 citations

Materials Engineering, Materials Science, Damascene Copper Plating +14

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 354 citations

Engineering, Severe Plastic Deformation, Thin Film Process Technology +16

Future directions in electroplated materials for thin-film recording heads

P. C. Andricacos, Neil Robertson · IBM Journal of Research and Development · 1998 · 139 citations

Magnetic Properties, Engineering, Mechanical Engineering +26

Electrodeposition of Nickel‐Iron Alloys: I . Effect of Agitation

P. C. Andricacos, C. Arana, J. Tabib et al. · Journal of The Electrochemical Society · 1989 · 106 citations

Materials Science, Electrode Surface, Magnetic Properties +13