P. C. Andricacos - Concepedia

Author

P. C. Andricacos

IBM Research - Thomas J. Watson Research Center

Also Known As

Andricacos, P.C. (International Business Machines Corp., Yorktown Heights, NY (United States). Thomas J. Watson Research Center), P Andricacos, P. Andricacos, P. C. ANDRICACOS, P. C. Andricacos, P.C. Andricacos, Panayotis Andricacos, Panayotis C. Andricacos

Publications

Citations

H-Index

Concepts

All Affiliations

IBM Research - Thomas J. Watson Research Center Columbia University IBM (United States)Lawrence Berkeley National Laboratory IBM Research - Almaden

About

P. C. Andricacos is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, electrochemistry, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	18	28	2.9K
2	Chemical Engineering	12	16	457
3	Applied Physics	10	11	1.9K
4	Chemistry	10	11	765
5	Natural Sciences	2	2	153

P. C. Andricacos

Publications

2.9K

Citations

H-Index

Page 1

	Year	Citations
Damascene copper electroplating for chip interconnections P. C. Andricacos, Cyprian Uzoh, John Dukovic, IBM Journal of Research and Development EngineeringChemical DepositionInterconnect (Integrated Circuits)Filling PerformanceOn-chip Metallization	1998	1.2K
The chemistry of additives in damascene copper plating Philippe M. Vereecken, Robert A. Binstead, Hariklia Deligianni, IBM Journal of Research and Development Materials EngineeringMaterials ScienceDamascene Copper PlatingEngineeringSurface Electrochemistry	2005	444
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature J. M. E. Harper, C. Cabral, P. C. Andricacos, Journal of Applied Physics EngineeringSevere Plastic DeformationThin Film Process TechnologyChemical DepositionGrain Size	1999	354
Future directions in electroplated materials for thin-film recording heads P. C. Andricacos, Neil Robertson IBM Journal of Research and Development Magnetic PropertiesEngineeringMechanical EngineeringThin Film Process TechnologyMagnetic Materials	1998	139
Electrodeposition of Nickel‐Iron Alloys: I . Effect of Agitation P. C. Andricacos, C. Arana, J. Tabib, Journal of The Electrochemical Society Materials ScienceElectrode SurfaceMagnetic PropertiesChemical EngineeringEngineering	1989	106
The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition S. Mehdizadeh, John Dukovic, P. C. Andricacos, Journal of The Electrochemical Society EngineeringElectron-beam LithographyMechanical EngineeringThickness DistributionLithographic Patterning	1992	91
The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass‐Transfer Effects S. Mehdizadeh, John Dukovic, P. C. Andricacos, Journal of The Electrochemical Society EngineeringMass‐transfer EffectsElectron-beam LithographyLithographic PatterningCurrent Densities	1993	58
Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes S. Mehdizadeh, John Dukovic, P. C. Andricacos, Journal of The Electrochemical Society Materials ScienceElectrical EngineeringEngineeringElectrode-electrolyte InterfaceElectrochemical Interface	1990	51
The effect of H2PO4− anion on the kinetics of oxygen reduction on Pt P. N. Ross, P. C. Andricacos Journal of Electroanalytical Chemistry Oxygen Reduction ReactionChemical EngineeringChemical KineticsEngineeringRedox Chemistry	1983	45
Determination of Partial Currents for CuNi and CuCo Electrodeposition Using Rotating Ring‐Disk Electrodes Jean Horkans, I‐Chia Hsu Chang, P. C. Andricacos, Journal of The Electrochemical Society Materials ScienceElectrometallurgyElectrical EngineeringChemical EngineeringEngineering	1991	38

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