J. M. E. Harper

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 445 citations

Engineering, Chemistry, Chemical Deposition +16

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 354 citations

Engineering, Severe Plastic Deformation, Thin Film Process Technology +16

Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering

F. M. d’Heurle, J. M. E. Harper · Thin Solid Films · 1989 · 290 citations

Materials Science, Materials Engineering, Engineering +9

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Reliability, Electrical Engineering, Reliability Engineering +8

Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology

H. R. Kaufman, J. J. Cuomo, J. M. E. Harper · Journal of Vacuum Science and Technology · 1982 · 251 citations

Electrical Engineering, Compact Ion Source, Engineering +13