J. M. E. Harper

Statistics

Publications

Citations

6.6K

H-Index

Active since

1973

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

IBM (United States)

University of New Hampshire

Stanford University

Colorado State University

J. M. E. Harper is an author at IBM Research - Thomas J. Watson Research Center specializing in materials science, natural sciences, and materials engineering.

Publications per year

1973–2008

Publications

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 448 citations

Engineering, Materials Engineering, Materials Science +17

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

Natural Sciences, Materials Engineering, Materials Science +17

Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering

F. M. d’Heurle, J. M. E. Harper · Thin Solid Films · 1989 · 293 citations

Natural Sciences, Materials Engineering, Materials Science +12

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Engineering, Materials Engineering, Materials Science +12

Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology

H. R. Kaufman, J. J. Cuomo, J. M. E. Harper · Journal of Vacuum Science and Technology · 1982 · 253 citations

Natural Sciences, Electrical Engineering, Physics +13

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