J. M. E. Harper - Concepedia

Author

J. M. E. Harper

IBM Research - Thomas J. Watson Research Center

Also Known As

J Harper, J M E Harper, J M. Harper, J. Harper, J. M. E. Harper, J. M. Harper, J.M. Harper, J.M.E Harper, J.M.E. HARPER, J.M.E. Harper

182

Publications

6.9K

Citations

H-Index

Concepts

All Affiliations

IBM Research - Thomas J. Watson Research Center IBM (United States)University of New Hampshire Stanford University Colorado State University

About

J. M. E. Harper is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	42	92	6.3K
2	Applied Physics	39	85	5.8K
3	Chemistry	13	17	1.2K
4	Natural Sciences	8	8	378
5	Chemical Engineering	5	5	264

J. M. E. Harper

Publications

6.6K

Citations

H-Index

Page 1

	Year	Citations
Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions Karen Holloway, P. M. Fryer, C. Cabral, Journal of Applied Physics EngineeringChemistryChemical DepositionNitrogen AdditionsNitrogen Alloy	1992	445
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature J. M. E. Harper, C. Cabral, P. C. Andricacos, Journal of Applied Physics EngineeringSevere Plastic DeformationThin Film Process TechnologyChemical DepositionGrain Size	1999	354
Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering F. M. d’Heurle, J. M. E. Harper Thin Solid Films Materials ScienceMaterials EngineeringEngineeringPhysicsSurface Science	1989	290
Copper interconnections and reliability C.‐K. Hu, J. M. E. Harper Materials Chemistry and Physics ReliabilityElectrical EngineeringReliability EngineeringCopper InterconnectionsEngineering	1998	280
Technology and applications of broad-beam ion sources used in sputtering. Part I. Ion source technology H. R. Kaufman, J. J. Cuomo, J. M. E. Harper Journal of Vacuum Science and Technology Electrical EngineeringCompact Ion SourceEngineeringIon ImplantationPhysics	1982	251
Technology and applications of broad-beam ion sources used in sputtering. Part II. Applications J. M. E. Harper, J. J. Cuomo, H. R. Kaufman Journal of Vacuum Science and Technology EngineeringPlasma ProcessingPhysical PropertiesBeam OpticIon Implantation	1982	213
Stress development and relaxation in copper films during thermal cycling M.D. Thouless, J. Gupta, J. M. E. Harper Journal of materials research/Pratt's guide to venture capital sources Materials ScienceElectromigration TechniqueEngineeringApplied PhysicsMetallurgical Interaction	1993	213
The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films L. A. Clevenger, A. Mutscheller, J. M. E. Harper, Journal of Applied Physics EngineeringThin Film Process TechnologyChemical DepositionSilicon On InsulatorTantalum Thin Films	1992	179
Microstructure control in semiconductor metallization J. M. E. Harper, K. P. Rodbell Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Materials ScienceEpitaxial GrowthEngineeringSevere Plastic DeformationCrystalline Defects	1997	162
Modification of niobium film stress by low-energy ion bombardment during deposition J. J. Cuomo, J. M. E. Harper, C. R. Guarnieri, Journal of Vacuum Science and Technology Niobium Film StressEngineeringVacuum DeviceChemical DepositionIon Implantation	1982	160

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