P. M. Fryer

Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

Karen Holloway, P. M. Fryer, C. Cabral et al. · Journal of Applied Physics · 1992 · 445 citations

Engineering, Chemistry, Chemical Deposition +16

Tantalum as a diffusion barrier between copper and silicon

Karen Holloway, P. M. Fryer · Applied Physics Letters · 1990 · 261 citations

Materials Engineering, Materials Science, Thin Tantalum Layers +13

High Temperature Process Limitation on TiSi2

C. Y. Ting, F. M. d’Heurle, Subramanian S. Iyer et al. · Journal of The Electrochemical Society · 1986 · 116 citations

Materials Engineering, Materials Science, Semiconductors +15

Patterning Indium Tin Oxide and Indium Zinc Oxide Using Microcontact Printing and Wet Etching

Tricia L. Breen, P. M. Fryer, Ronald Nunes et al. · Langmuir · 2001 · 95 citations

Engineering, Pattern Transfer, Wet Etching +19

Room-temperature oxidation of silicon catalyzed by Cu3Si

J. M. E. Harper, A. Charaı̈, Lars Stolt et al. · Applied Physics Letters · 1990 · 89 citations

Materials Science, Room Temperature, Chemical Engineering +12