C. Y. Ting

The use of titanium-based contact barrier layers in silicon technology

C. Y. Ting, M. Wittmer · Thin Solid Films · 1982 · 169 citations

Materials Science, Materials Engineering, Engineering +11

TiN formed by evaporation as a diffusion barrier between Al and Si

C. Y. Ting · Journal of Vacuum Science and Technology · 1982 · 168 citations

Aluminium Nitride, Engineering, Material Innovation +18

High Temperature Process Limitation on TiSi2

C. Y. Ting, F. M. d’Heurle, Subramanian S. Iyer et al. · Journal of The Electrochemical Society · 1986 · 116 citations

Materials Engineering, Materials Science, Semiconductors +15

Interaction Between Ti and SiO2

C. Y. Ting, M. Wittmer, Subramanian S. Iyer et al. · Journal of The Electrochemical Society · 1984 · 79 citations

Materials Engineering, Inorganic Chemistry, Materials Science +15

Oxidation of silicide thin films: TiSi2

F. M. d’Heurle, E. A. Irene, C. Y. Ting · Applied Physics Letters · 1983 · 76 citations

Materials Engineering, Materials Science, Silicide Thin Films +12