C.‐K. Hu

Copper Metallization for High Performance Silicon Technology

R. Rosenberg, D. Edelstein, C.‐K. Hu et al. · Annual Review of Materials Science · 2000 · 419 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +18

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 354 citations

Engineering, Severe Plastic Deformation, Thin Film Process Technology +16

Electromigration path in Cu thin-film lines

C.‐K. Hu, R. Rosenberg, K. Y. Lee · Applied Physics Letters · 1999 · 325 citations

Engineering, Interconnect (Integrated Circuits), Surface Transport +16

Copper interconnections and reliability

C.‐K. Hu, J. M. E. Harper · Materials Chemistry and Physics · 1998 · 280 citations

Reliability, Electrical Engineering, Reliability Engineering +8

Copper interconnection integration and reliability

C.‐K. Hu, B. M. Luther, F. B. Kaufman et al. · Thin Solid Films · 1995 · 222 citations

Reliability, Copper Interconnection Integration, Electrical Engineering +8