Concepedia

Copper interconnection integration and reliability

C.‐K. Hu, B. M. Luther, F. B. Kaufman, J.P. Hummel, Cyprian Uzoh, D.J. Pearson

Thin Solid Films · 1995 · 224 citations · 12 references

DOI

Concepts

References

12

Electromigration in thin aluminum films on titanium nitride

I. A. Blech · Journal of Applied Physics · 1976 · 1.2K citations

, , +17

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

F. B. Kaufman, Daniel B. Thompson, R. E. Broadie et al. · Journal of The Electrochemical Society · 1991 · 511 citations

, , +17

Diffusion phenomena in thin films and microelectronic materials

H.K.H. · Materials Research Bulletin · 1989 · 218 citations

, , +16

Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide

Shi‐Qing Wang · MRS Bulletin · 1994 · 195 citations

, , +14

Inhibition of Electromigration Damage in Thin Films

R. Rosenberg · Journal of Vacuum Science and Technology · 1972 · 117 citations

, , +14