C-K. Hu

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra et al. · Applied Physics Letters · 2001 · 98 citations

Engineering, Electrical Engineering, Materials Science +16

Materials Issues in Copper Interconnections

J. M. E. Harper, E. G. Colgan, C-K. Hu et al. · MRS Bulletin · 1994 · 78 citations

Natural Sciences, Materials Engineering, Materials Science +9

Electromigration in 0.25 μm wide Cu line on W

C-K. Hu, K.Y Lee, L. Gignac et al. · Thin Solid Films · 1997 · 63 citations

Engineering, Electrical Engineering, Materials Science +9

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Natural Sciences, Materials Engineering, Materials Science +15

The microstructural stability of Al(Cu) lines during electromigration

T. M. Shaw, C-K. Hu, K. Y. Lee et al. · Applied Physics Letters · 1995 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17