S. G. Malhotra

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra et al. · Applied Physics Letters · 2001 · 96 citations

Engineering, Charge Transport, Interconnect (Integrated Circuits) +17

Picosecond ultrasonics study of the vibrational modes of a nanostructure

G. A. Antonelli, Humphrey J. Maris, S. G. Malhotra et al. · Journal of Applied Physics · 2002 · 96 citations

Time-delayed Probe Light, Optical Materials, Glass Matrix +21

A high performance liner for copper damascene interconnects

D. Edelstein, Cyprian Uzoh, C. Cabral et al. · 2001 · 90 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +13

Analysis of thin film stress measurement techniques

S. G. Malhotra, Z. U. Rek, S. M. Yalisove et al. · Thin Solid Films · 1997 · 65 citations

Engineering, Stressstrain Analysis, Solid Mechanics +4

Electromigration Cu mass flow in Cu interconnections

C.‐K. Hu, D. Canaperi, S.T. Chen et al. · Thin Solid Films · 2005 · 34 citations

Electrical Engineering, Electromigration Technique, Engineering +7