C.‐K. Hu

Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures

In‐Seok Yeo, Steven G. Anderson, Paul S. Ho et al. · Journal of Applied Physics · 1995 · 39 citations

Aluminium Nitride, Engineering, Severe Plastic Deformation +20

Electromigration Cu mass flow in Cu interconnections

C.‐K. Hu, D. Canaperi, S.T. Chen et al. · Thin Solid Films · 2005 · 34 citations

Electrical Engineering, Electromigration Technique, Engineering +7

An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

Ryan Smith, E. Todd Ryan, C.‐K. Hu et al. · AIP Advances · 2019 · 30 citations · Full text

Engineering, Optical Properties, Numerical Simulation +18

Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Pinhe Wang, I. C. Noyan, S. Kaldor et al. · Applied Physics Letters · 2000 · 27 citations

Engineering, Residual Stress, Stress Evolution +18

Real-time x-ray microbeam characterization of electromigration effects in Al(Cu) wires

Pinhe Wang, I. C. Noyan, S. Kaldor et al. · Applied Physics Letters · 2001 · 22 citations

Aluminium Nitride, X-ray Spectroscopy, Engineering +19