C.‐K. Hu

Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structures

In‐Seok Yeo, Steven G. Anderson, Paul S. Ho et al. · Journal of Applied Physics · 1995 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electromigration Cu mass flow in Cu interconnections

C.‐K. Hu, D. Canaperi, S.T. Chen et al. · Thin Solid Films · 2005 · 34 citations

Engineering, Materials Engineering, Materials Science +14

An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines

Ryan Smith, E. Todd Ryan, C.‐K. Hu et al. · AIP Advances · 2019 · 32 citations · Full text

Natural Sciences, Materials Science, Physics +16

Topographic measurement of electromigration-induced stress gradients in aluminum conductor lines

Pinhe Wang, I. C. Noyan, S. Kaldor et al. · Applied Physics Letters · 2000 · 27 citations

Natural Sciences, Electrical Engineering, Materials Science +17

High-Q electromagnetically induced transparency and slow-light manipulation via utilizing the quasi-BICs

C.‐K. Hu, Xiaoshan Liu, Juan Deng et al. · Optics Communications · 2025 · 24 citations

Natural Sciences, Electrical Engineering, Physics +12