Concepedia

D. Canaperi

DC

Statistics

Publications

35

Citations

1.1K

H-Index

18

Active since

1988

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

GlobalFoundries (United States)

STMicroelectronics (United States)

Albany Technical College

D. Canaperi is an author at IBM (United States) specializing in semiconductor devices, materials science, and materials engineering.

Publications per year

1988–2018

35

Publications

35

Fabrication and mobility characteristics of ultra-thin strained Si directly on insulator (SSDOI) MOSFETs

K. Rim, K. Chan, L. Shi et al. · 2004 · 156 citations

Engineering, Electrical Engineering, Materials Science +17

SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors

Lida Huang, J. O. Chu, D. Canaperi et al. · Applied Physics Letters · 2001 · 111 citations

Engineering, Materials Engineering, Materials Science +17

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui et al. · 2016 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electron and hole mobility enhancement in strained SOI by wafer bonding

Lijuan Huang, J. O. Chu, S. Goma et al. · IEEE Transactions on Electron Devices · 2002 · 57 citations

Engineering, Electrical Engineering, Materials Science +14

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

Chunhua Hu, D. Canaperi, S.T. Chen et al. · 2004 · 56 citations

Engineering, Electrical Engineering, Materials Science +16

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