Chunhua Hu - Concepedia

Author

Chunhua Hu

IBM (United States)ORCID

Also Known As

C. -K. Hu, C. Hu, C. K. Hu, C.-K. Hu, C.K. Hu, Chao‐Kun Hu, Chenshun Hu, Chungsheng Hu, Chunhua Hu, Cunlong Hu

Publications

1.3K

Citations

H-Index

Concepts

All Affiliations

IBM (United States)IBM Research - Thomas J. Watson Research Center GlobalFoundries (United States)Rensselaer Polytechnic Institute STMicroelectronics (United States)

About

Chunhua Hu is an author at IBM (United States) specializing in electrical engineering, engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	16	22	1.1K
2	Applied Physics	13	16	861
3	Chemistry	3	3	70
4	Chemical Engineering	1	1	40
5	Computer Engineering	1	1	28

Chunhua Hu

Publications

1.2K

Citations

H-Index

Page 1

	Year	Citations
Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation Chunhua Hu, M. B. Small, Paul S. Ho Journal of Applied Physics Aluminium NitrideEngineeringDamage Formation ProcessMechanical EngineeringInterconnect (Integrated Circuits)	1993	155
Electromigration of Cu/low dielectric constant interconnects Chunhua Hu, L. Gignac, R. Rosenberg Microelectronics Reliability Electrical EngineeringElectromigration TechniqueEngineeringNanoelectronicsApplied Physics	2005	145
Sub-μm, planarized, Nb-AlO<i>x</i>-Nb Josephson process for 125 mm wafers developed in partnership with Si technology M. B. Ketchen, D.J. Pearson, A. W. Kleinsasser, Applied Physics Letters Superconducting MaterialEngineeringSi TechnologyJosephson JunctionsWafer Scale Processing	1991	107
Electromigration in two-level interconnects of Cu and Al alloys Chunhua Hu, B. M. Luther Materials Chemistry and Physics Materials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringApplied Physics	1995	74
<i>In situ</i> study of void growth kinetics in electroplated Cu lines E. Liniger, Lynne Gignac, Chunhua Hu, Journal of Applied Physics EngineeringVoid GrowthChemical DepositionElectroplated Cu LinesVoid Growth Rate	2002	69
Future on-chip interconnect metallization and electromigration Chunhua Hu, James J. Kelly, Huai Huang, Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueCu Liner	2018	69
Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections Chunhua Hu Thin Solid Films Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineering	1995	68
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects Chunhua Hu, D. Canaperi, S.T. Chen, EngineeringInterconnect (Integrated Circuits)Electromigration Reliability ImprovementAdvanced Packaging (Semiconductors)Nanoelectronics	2004	56
Electromigration in Cu(Al) and Cu(Mn) damascene lines Chunhua Hu, J. Ohm, Lynne Gignac, Journal of Applied Physics Materials ScienceEm LifetimesElectrical EngineeringElectromigration TechniqueEngineering	2012	54
Diffusion and electromigration of silver and nickel in lead-tin alloys Chunhua Hu, H. B. Huntington Physical review. B, Condensed matter	1982	50

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