Chunhua Hu

Electromigration in Al(Cu) two-level structures: Effect of Cu and kinetics of damage formation

Chunhua Hu, M. B. Small, Paul S. Ho · Journal of Applied Physics · 1993 · 155 citations

Aluminium Nitride, Engineering, Damage Formation Process +20

Electromigration of Cu/low dielectric constant interconnects

Chunhua Hu, L. Gignac, R. Rosenberg · Microelectronics Reliability · 2005 · 145 citations

Electrical Engineering, Electromigration Technique, Engineering +7

Sub-μm, planarized, Nb-AlO<i>x</i>-Nb Josephson process for 125 mm wafers developed in partnership with Si technology

M. B. Ketchen, D.J. Pearson, A. W. Kleinsasser et al. · Applied Physics Letters · 1991 · 107 citations

Superconducting Material, Engineering, Si Technology +17

Electromigration in two-level interconnects of Cu and Al alloys

Chunhua Hu, B. M. Luther · Materials Chemistry and Physics · 1995 · 74 citations

Materials Engineering, Electrical Engineering, Electromigration Technique +7

<i>In situ</i> study of void growth kinetics in electroplated Cu lines

E. Liniger, Lynne Gignac, Chunhua Hu et al. · Journal of Applied Physics · 2002 · 69 citations

Engineering, Void Growth, Chemical Deposition +16