L. Gignac

Electromigration of Cu/low dielectric constant interconnects

Chunhua Hu, L. Gignac, R. Rosenberg · Microelectronics Reliability · 2005 · 145 citations

Electrical Engineering, Electromigration Technique, Engineering +7

Stable ultrahigh-density magneto-optical recordings using introduced linear defects

L. Krusin‐Elbaum, T. Shibauchi, B. E. Argyle et al. · Nature · 2001 · 135 citations · Full text

Magnetism, Spintronics, Engineering +9

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Engineering, Advanced Packaging (Semiconductors), Corrosion +17

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra et al. · Applied Physics Letters · 2001 · 96 citations

Engineering, Charge Transport, Interconnect (Integrated Circuits) +17

High-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam deposition

Supratik Guha, E. Cartier, N. A. Bojarczuk et al. · Journal of Applied Physics · 2001 · 96 citations

Engineering, Alternate Gate Dielectrics, Ultrahigh Vacuum +18