L. Gignac

Electromigration of Cu/low dielectric constant interconnects

Chunhua Hu, L. Gignac, R. Rosenberg · Microelectronics Reliability · 2005 · 146 citations

Engineering, Electrical Engineering, Materials Science +12

Stable ultrahigh-density magneto-optical recordings using introduced linear defects

L. Krusin‐Elbaum, T. Shibauchi, B. E. Argyle et al. · Nature · 2001 · 138 citations · Full text

Natural Sciences, Materials Science, Physics +14

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Natural Sciences, Electrical Engineering, Materials Science +16

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra et al. · Applied Physics Letters · 2001 · 98 citations

Engineering, Electrical Engineering, Materials Science +16

High-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam deposition

Supratik Guha, E. Cartier, N. A. Bojarczuk et al. · Journal of Applied Physics · 2001 · 97 citations

Natural Sciences, Materials Engineering, Materials Science +17