Electromigration of Cu/low dielectric constant interconnects

<i>Grain Boundaries in Metals</i>

David McLean, A. A. Maradudin · Physics Today · 1958 · 1.9K citations

Natural Sciences, Materials Engineering, Materials Science +12

Electromigration in thin aluminum films on titanium nitride

I. A. Blech · Journal of Applied Physics · 1976 · 1.2K citations

Engineering, Materials Engineering, Materials Science +17

Max Hansen and Kurt Anderko: Constitution of Binary Alloys. McGraw-Hill Book Co., New York, 1958, 1305頁, 23×16cm, \13.000.

秀世 間庭 · 日本物理學會誌 · 1958 · 722 citations

Natural Sciences, Materials Engineering, Materials Science +9

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J. M. E. Harper, C. Cabral, P. C. Andricacos et al. · Journal of Applied Physics · 1999 · 359 citations

Natural Sciences, Materials Engineering, Materials Science +17

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

Engineering, Computer Engineering, Electrical Engineering +17