A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar, +84

EngineeringElectron-beam LithographyFinfet TechnologyMechanical EngineeringWafer Scale Processing +16

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang, +21

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueCu Liner +13

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui, +21

Mol Local InterconnectsEngineeringCvd W-based MetallizationWafer Scale ProcessingAdvanced Packaging (Semiconductors) +19

Predicting tissue distribution and tumor delivery of nanoparticles in mice using machine learning models

Kun Mi, Wei‐Chun Chou, Qiran Chen, +7

Journal of Controlled Release

Experimental study of nanoscale Co damascene BEOL interconnect structures

James J. Kelly, Jinai Chen, Huai Huang, +14

EngineeringNm Node DimensionsMaterial InnovationCo Line ResistanceInterconnect (Integrated Circuits) +14

Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires

Chunhua Hu, James J. Kelly, J. H-C Chen, +19

EngineeringInterconnect (Integrated Circuits)NanoelectronicsElectronic PackagingCo Cap +16

Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs Beyond 7nm

Heng Wu, Oleg Gluschenkov, Gen Tsutsui, +31

Low-power ElectronicsDevice ModelingElectrical EngineeringEngineeringVlsi Design +11

Ti and NiPt/Ti liner silicide contacts for advanced technologies

Praneet Adusumilli, Emre Alptekin, M. Raymond, +68

Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringNanoelectronics +13

Comprehensive study of effective current variability and MOSFET parameter correlations in 14nm multi-fin SOI FINFETs

A. Paul, A. Bryant, Terence B. Hook, +15

Sub XmlnsEngineeringIntegrated CircuitsMulti-fin Soi FinfetsSilicon On Insulator +14

Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization

James J. Kelly, V. Kamineni, Xuan Lin, +10

Journal of The Electrochemical Society

EngineeringAcidic Sulfate ChemistryElectrode-electrolyte InterfaceThin Film Process TechnologyPhotovoltaics +20