V. Kamineni

A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels

Ruijie Xie, P. Montanini, Kerem Akarvardar et al. · 2016 · 139 citations

Engineering, Electron-beam Lithography, Finfet Technology +18

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 69 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Tungsten and cobalt metallization: A material study for MOL local interconnects

V. Kamineni, M. Raymond, S. Siddiqui et al. · 2016 · 63 citations

Mol Local Interconnects, Engineering, Cvd W-based Metallization +21

Predicting tissue distribution and tumor delivery of nanoparticles in mice using machine learning models

Kun Mi, Wei‐Chun Chou, Qiran Chen et al. · Journal of Controlled Release · 2024 · 61 citations · Full text

Experimental study of nanoscale Co damascene BEOL interconnect structures

James J. Kelly, Jinai Chen, Huai Huang et al. · 2016 · 51 citations

Engineering, Nm Node Dimensions, Material Innovation +16