Pull-in study of an electrostatic torsion microactuator

Ofir Degani, Eran Socher, Ariel Lipson, +4

Journal of Microelectromechanical Systems

Electrical EngineeringEngineeringSoft RoboticsTorsion MicroactuatorMicrofabrication +12

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger, +6

Applied Physics Letters

EngineeringAdvanced Packaging (Semiconductors)CorrosionCu InterconnectsElectronic Packaging +15

<i>In situ</i> study of void growth kinetics in electroplated Cu lines

E. Liniger, Lynne Gignac, Chunhua Hu, +1

Journal of Applied Physics

EngineeringVoid GrowthChemical DepositionElectroplated Cu LinesVoid Growth Rate +14

On the CAD of Profiles for Cutters and Helical Flutes - Geometrical Aspects

S. Kaldor, Ada Mod Rafael, D. Messinger

CIRP Annals

Geometric ModelingEngineeringGeometryNatural SciencesDigital Fabrication +11

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

Chunhua Hu, D. Canaperi, S.T. Chen, +13

EngineeringInterconnect (Integrated Circuits)Electromigration Reliability ImprovementAdvanced Packaging (Semiconductors)Nanoelectronics +17

Characterization of substrate/thin-film interfaces with x-ray microdiffraction

I. C. Noyan, Jean Jordan‐Sweet, E. Liniger, +1

Applied Physics Letters

Materials ScienceSurface CharacterizationEngineeringCrystalline DefectsMicrofabrication +12

Electromigration Cu mass flow in Cu interconnections

C.‐K. Hu, D. Canaperi, S.T. Chen, +14

Thin Solid Films

Electrical EngineeringElectromigration TechniqueEngineeringApplied PhysicsMetallurgical Interaction +5

Differentiating between elastically bent rectangular beams and plates

S. Kaldor, I. C. Noyan

Applied Physics Letters

EngineeringMultiscale MechanicsMechanical EngineeringStructural OptimizationAnisotropic Strip +24

Observation of local tilted regions in strain-relaxed SiGe/Si buffer layers using x-ray microdiffraction

P. M. Mooney, Jean Jordan‐Sweet, I. C. Noyan, +2

Applied Physics Letters

EngineeringSevere Plastic DeformationLocal Tilted RegionsSilicon On InsulatorX-ray Imaging +19

Deformation field in single-crystal fields semiconductor substrates caused by metallization features

I. C. Noyan, Pinhe Wang, S. Kaldor, +1

Applied Physics Letters

EngineeringSevere Plastic DeformationCrystal Growth TechnologyThin Film Process TechnologyDeformation Field +17