S. Kaldor

Pull-in study of an electrostatic torsion microactuator

Ofir Degani, Eran Socher, Ariel Lipson et al. · Journal of Microelectromechanical Systems · 1998 · 242 citations

Electrical Engineering, Engineering, Soft Robotics +14

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

C.‐K. Hu, L. Gignac, E. Liniger et al. · Applied Physics Letters · 2003 · 108 citations

Engineering, Advanced Packaging (Semiconductors), Corrosion +17

<i>In situ</i> study of void growth kinetics in electroplated Cu lines

E. Liniger, Lynne Gignac, Chunhua Hu et al. · Journal of Applied Physics · 2002 · 69 citations

Engineering, Void Growth, Chemical Deposition +16

On the CAD of Profiles for Cutters and Helical Flutes - Geometrical Aspects

S. Kaldor, Ada Mod Rafael, D. Messinger · CIRP Annals · 1988 · 68 citations

Geometric Modeling, Engineering, Geometry +13

Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects

Chunhua Hu, D. Canaperi, S.T. Chen et al. · 2004 · 56 citations

Engineering, Interconnect (Integrated Circuits), Electromigration Reliability Improvement +19