Thin Solid Films · 2005 · 34 citations · 11 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesTransport PhenomenaElectric CircuitsElectrical ConductivityIntegrated Circuit FabricationInterconnect ArchitectureInterconnect TechnologyInterfacial Mass TransferCopper InterconnectsElectromigrationElectromigration ReliabilityInterconnect FabricationMass Transport Phenomena
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Copper Metallization for High Performance Silicon Technology
R. Rosenberg, D. Edelstein, C.‐K. Hu et al. · Annual Review of Materials Science · 2000 · 423 citations
Engineering, Electrical Engineering, Materials Engineering +16
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations
Engineering, Computer Engineering, Electrical Engineering +17
Reduced electromigration of Cu wires by surface coating
C.‐K. Hu, Lynne Gignac, R. Rosenberg et al. · Applied Physics Letters · 2002 · 215 citations
Natural Sciences, Electrical Engineering, Materials Engineering +17
Isotope Effect and Divacancies for Self‐Diffusion in Copper
S. J. Rothman, N.L. Peterson · physica status solidi (b) · 1969 · 212 citations
Natural Sciences, Chemistry, Physics +13