Concepedia

J. R. Lloyd

JR

Statistics

Publications

65

Citations

3.6K

H-Index

28

Active since

1977

Affiliations

IBM (United States)(Current)

IBM Research - Thomas J. Watson Research Center

Digital Wave (United States)

SUNY Polytechnic Institute

Stevens Institute of Technology

J. R. Lloyd is an author at IBM (United States) specializing in electronic materials, materials science, and electromigration.

Publications per year

1977–2017

65

Publications

65

A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2

M. Shatzkes, J. R. Lloyd · Journal of Applied Physics · 1986 · 302 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Electromigration in copper conductors

J. R. Lloyd, J. J. Clement · Thin Solid Films · 1995 · 234 citations

Engineering, Electrical Engineering, Materials Engineering +11

Electromigration in integrated circuit conductors

J. R. Lloyd · Journal of Physics D Applied Physics · 1999 · 200 citations

Engineering, Electrical Engineering, Materials Science +16

Copper metallization reliability

J. R. Lloyd, Jack Clemens, R Snede · Microelectronics Reliability · 1999 · 167 citations

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