Concepedia

Michael Lane

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Statistics

Publications

34

Citations

2.6K

H-Index

20

Active since

1997

Affiliations

IBM (United States)(Current)

Rensselaer Polytechnic Institute

IBM Research - Thomas J. Watson Research Center

Stanford University

Emory and Henry College

Michael Lane is an author at IBM (United States) specializing in materials science, natural sciences, and materials engineering.

Publications per year

1997–2018

34

Publications

34

Adhesion and debonding of multi-layer thin film structures

Reinhold H. Dauskardt, Michael Lane, Qing Ma et al. · Engineering Fracture Mechanics · 1998 · 629 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

Michael Lane, Reinhold H. Dauskardt, Nety Krishna et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +14

Plasticity contributions to interface adhesion in thin-film interconnect structures

Michael Lane, Reinhold H. Dauskardt, Anna Vainchtein et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 172 citations

Natural Sciences, Materials Engineering, Materials Science +14

Liner materials for direct electrodeposition of Cu

Michael Lane, Conal E. Murray, F. R. McFeely et al. · Applied Physics Letters · 2003 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +15

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