Concepedia

Michael Lane

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Statistics

Publications

34

Citations

2.5K

H-Index

20

Active since

1997

Affiliations

IBM (United States)(Current)

Rensselaer Polytechnic Institute

IBM Research - Thomas J. Watson Research Center

Stanford University

Emory and Henry College

Michael Lane is an author at IBM (United States) specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingSurface ScienceMicroelectronicsElectrical EngineeringMaterials EngineeringMechanical EngineeringThin Films

Publications per year

1997–2018

34

Publications

34

Adhesion and debonding of multi-layer thin film structures

Reinhold H. Dauskardt, Michael Lane, Qing Ma et al. · Engineering Fracture Mechanics · 1998 · 623 citations · Full text

Materials Science, Materials Engineering, Engineering +14

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Engineering, Interfacial Adhesion, Cu Conductor +17

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

Michael Lane, Reinhold H. Dauskardt, Nety Krishna et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 185 citations

Materials Science, Electrical Engineering, Electromigration Technique +11

Plasticity contributions to interface adhesion in thin-film interconnect structures

Michael Lane, Reinhold H. Dauskardt, Anna Vainchtein et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 172 citations

Materials Science, Engineering, Plasticity Contributions +6

Liner materials for direct electrodeposition of Cu

Michael Lane, Conal E. Murray, F. R. McFeely et al. · Applied Physics Letters · 2003 · 162 citations

Engineering, Chemical Deposition, Electrometallurgy +17

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