J. J. Clement

Electromigration in copper conductors

J. R. Lloyd, J. J. Clement · Thin Solid Films · 1995 · 234 citations

Engineering, Electrical Engineering, Materials Engineering +11

Modeling electromigration-induced stress evolution in confined metal lines

J. J. Clement, Carl V. Thompson · Journal of Applied Physics · 1995 · 101 citations

Natural Sciences, Electrical Engineering, Materials Science +12

Electromigration modeling for integrated circuit interconnect reliability analysis

J. J. Clement · IEEE Transactions on Device and Materials Reliability · 2001 · 83 citations

Engineering, Computer Engineering, Electrical Engineering +17

Reliability analysis for encapsulated interconnect lines under dc and pulsed dc current using a continuum electromigration transport model

J. J. Clement · Journal of Applied Physics · 1997 · 72 citations

Engineering, Electrical Engineering, Materials Science +17

Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects

B. D. Knowlton, J. J. Clement, Carl V. Thompson · Journal of Applied Physics · 1997 · 70 citations

Engineering, Electrical Engineering, Materials Science +17