Concepedia

J. Maniscalco

JM

10

Publications

276

Citations

10

H-Index

2010

Active since

Affiliations

IBM (United States)(Current)

GlobalFoundries (United States)

STMicroelectronics (United States)

STMicroelectronics (Switzerland)

IBM Research - Thomas J. Watson Research Center

J. Maniscalco is an author at IBM (United States) specializing in materials science, engineering, and applied physics.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMaterials EngineeringElectrical EngineeringMicroelectronicsNanoelectronicsSurface ScienceElectronic PackagingElectrical Insulation

Publications per year

2010–2019

10

Publications

10

Electromigration in Cu(Al) and Cu(Mn) damascene lines

Chunhua Hu, J. Ohm, Lynne Gignac et al. · Journal of Applied Physics · 2012 · 54 citations

Materials Science, Em Lifetimes, Electrical Engineering +9

Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

Nicholas A. Lanzillo, K. Choi, C.-C. Yang et al. · IEEE Electron Device Letters · 2019 · 47 citations

Engineering, Cobalt Liner Thickness, Tan Barrier +17

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Materials Science, Materials Engineering, Cvd Co +15

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly et al. · 2017 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

T. Nogami, R. Patlolla, James J. Kelly et al. · 2017 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +14

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