J. Maniscalco

Electromigration in Cu(Al) and Cu(Mn) damascene lines

Chunhua Hu, J. Ohm, Lynne Gignac et al. · Journal of Applied Physics · 2012 · 54 citations

Materials Science, Em Lifetimes, Electrical Engineering +9

Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

Nicholas A. Lanzillo, K. Choi, C.-C. Yang et al. · IEEE Electron Device Letters · 2019 · 47 citations

Engineering, Cobalt Liner Thickness, Tan Barrier +17

CVD Co and its application to Cu damascene interconnections

T. Nogami, J. Maniscalco, Anita Madan et al. · 2010 · 43 citations

Materials Science, Materials Engineering, Cvd Co +15

Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node

T. Nogami, Xingxing Zhang, James J. Kelly et al. · 2017 · 30 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

T. Nogami, R. Patlolla, James J. Kelly et al. · 2017 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +14