C.-C. Yang

Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects

C.-C. Yang, Sidney Cohen, T. M. Shaw et al. · IEEE Electron Device Letters · 2010 · 90 citations

Natural Sciences, Materials Engineering, Materials Science +15

Electromigration challenges for advanced on-chip Cu interconnects

Baozhen Li, C. Christiansen, D. Badami et al. · Microelectronics Reliability · 2014 · 83 citations

Engineering, Electrical Engineering, Materials Science +14

Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects

Nicholas A. Lanzillo, K. Choi, C.-C. Yang et al. · IEEE Electron Device Letters · 2019 · 47 citations

Engineering, Electrical Engineering, Materials Science +17

Poly(<scp>l</scp>-lactic acid) with Segmented Perfluoropolyether Enchainment

D.M. Haynes, Amit K. Naskar, Akhilesh Kumar Singh et al. · Macromolecules · 2007 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electromigration comparison of selective CVD cobalt capping with PVD Ta(N) and CVD cobalt liners on 22nm-groundrule dual-damascene Cu interconnects

A. Simon, T. Bolom, Chunping Niu et al. · 2013 · 40 citations

Engineering, Materials Engineering, Materials Science +14