D. Badami

Reliability challenges for copper interconnects

Baozhen Li, Timothy D. Sullivan, Tom C. Lee et al. · Microelectronics Reliability · 2003 · 285 citations

Engineering, Electrical Engineering, Materials Science +14

Electromigration challenges for advanced on-chip Cu interconnects

Baozhen Li, C. Christiansen, D. Badami et al. · Microelectronics Reliability · 2014 · 83 citations

Engineering, Electrical Engineering, Materials Science +14

A 0.25 μm CMOS SOI technology and its application to 4 Mb SRAM

D. Schepis, F. Assaderaghi, D. S. Yee et al. · 2002 · 51 citations

Engineering, Computer Engineering, Electrical Engineering +12

Critical ultra low-k TDDB reliability issues for advanced CMOS technologies

F. Chen, M. Shinosky, B. Li et al. · 2009 · 27 citations

Engineering, Electrical Engineering, Electronic Materials +16

A robust reliability methodology for accurately predicting Bias Temperature Instability induced circuit performance degradation in HKMG CMOS

Dimitris P. Ioannou, Kai Zhao, Aditya Bansal et al. · 2011 · 14 citations

Engineering, Electrical Engineering, Circuit Theory +16