Electromigration challenges for advanced on-chip Cu interconnects

Electromigration in thin aluminum films on titanium nitride

I. A. Blech · Journal of Applied Physics · 1976 · 1.2K citations

Engineering, Materials Engineering, Materials Science +17

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 352 citations

Engineering, Computer Engineering, Electrical Engineering +17

Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

C-K. Hu, L. Gignac, S. G. Malhotra et al. · Applied Physics Letters · 2001 · 98 citations

Engineering, Electrical Engineering, Materials Science +16

Electromigration modeling for integrated circuit interconnect reliability analysis

J. J. Clement · IEEE Transactions on Device and Materials Reliability · 2001 · 83 citations

Engineering, Computer Engineering, Electrical Engineering +17

Impact of Cu microstructure on electromigration reliability

Chao Hu, L. Gignac, B. G. Baker et al. · 2007 · 63 citations

Engineering, Electrical Engineering, Materials Science +17