B. Li

Critical ultra low-k TDDB reliability issues for advanced CMOS technologies

F. Chen, M. Shinosky, B. Li et al. · 2009 · 27 citations

Engineering, Electrical Engineering, Electronic Materials +16

Line Depletion Electromigration Characterization of Cu Interconnects

B. Li, Timothy D. Sullivan, T.C. Lee · IEEE Transactions on Device and Materials Reliability · 2004 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics

F. Chen, J. Gill, D. Harmon et al. · 2004 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +17

In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects

C.-C. Yang, B. Li, H. Shobha et al. · IEEE Electron Device Letters · 2012 · 20 citations

Engineering, Materials Engineering, Materials Science +11

Wiener-filter-based Minimum Variance Self-tuning Regulation

Roberto Horowitz, B. Li, James McCormick · Automatica · 1998 · 20 citations

Engineering, Industrial Engineering, Optimization +11