Timothy D. Sullivan

Reliability challenges for copper interconnects

Baozhen Li, Timothy D. Sullivan, Tom C. Lee et al. · Microelectronics Reliability · 2003 · 285 citations

Engineering, Electrical Engineering, Materials Science +14

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

C.‐K. Hu, Kenneth P. Rodbell, Timothy D. Sullivan et al. · IBM Journal of Research and Development · 1995 · 134 citations

Engineering, Electrical Engineering, Materials Engineering +17

3D copper TSV integration, testing and reliability

Mukta Farooq, Troy Graves-Abe, W. Landers et al. · 2011 · 107 citations

Engineering, Electrical Engineering, Materials Science +17

Electric vehicles and natural disaster policy implications

Shawn A. Adderly, Daria Manukian, Timothy D. Sullivan et al. · Energy Policy · 2017 · 85 citations

Planning, Emergency Planning, Public Policy +14

Stress-migration related electromigration damage mechanism in passivated, narrow interconnects

C.-Y. Li, P. Bo rgesen, Timothy D. Sullivan · Applied Physics Letters · 1991 · 50 citations

Engineering, Electrical Engineering, Materials Science +17