W. Landers

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D copper TSV integration, testing and reliability

Mukta Farooq, Troy Graves-Abe, W. Landers et al. · 2011 · 107 citations

Engineering, Electrical Engineering, Materials Science +17

High-performance superconducting quantum processors via laser annealing of transmon qubits

Eric Zhang, Srikanth Srinivasan, Neereja Sundaresan et al. · Science Advances · 2022 · 84 citations · Full text

Computing, Computer Science, Physics +17

Hamiltonian Engineering with Multicolor Drives for Fast Entangling Gates and Quantum Crosstalk Cancellation

Ken Xuan Wei, Easwar Magesan, Isaac Lauer et al. · Physical Review Letters · 2022 · 80 citations

Computing, Computer Engineering, Physics +17

Demonstration of quantum volume 64 on a superconducting quantum computing system

Petar Jurcevic, Ali Javadi-Abhari, Lev S. Bishop et al. · Quantum Science and Technology · 2021 · 51 citations · Full text

Computing, Computer Engineering, Computer Science +17