Troy Graves-Abe

3D copper TSV integration, testing and reliability

Mukta Farooq, Troy Graves-Abe, W. Landers et al. · 2011 · 106 citations

3D Ic Architecture, Electrical Engineering, Engineering +15

Solvent-enhanced dye diffusion in polymer thin films for polymer light-emitting diode application

Troy Graves-Abe, Florian Pschenitzka, H. Z. Jin et al. · Journal of Applied Physics · 2004 · 25 citations

Engineering, Organic Electronics, Luminescence Property +16

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology

Pooja Batra, Spyridon Skordas, D. LaTulipe et al. · Journal of Low Power Electronics and Applications · 2014 · 19 citations · Full text

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias

T. Kirihata, John Golz, M.R. Wordeman et al. · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 2016 · 18 citations

Engineering, Emerging Memory Technology, Computer Architecture +16

Submicron mapping of strain distributions induced by three-dimensional through-silicon via features

Conal E. Murray, Troy Graves-Abe, Robert R. Robison et al. · Applied Physics Letters · 2013 · 16 citations

Engineering, X-ray Microbeam Diffraction, Mechanical Engineering +21