C.-Y. Li

Thermal-stress-induced voiding in narrow, passivated Cu lines

P. Bo rgesen, J. K. Lee, R. J. Gleixner et al. · Applied Physics Letters · 1992 · 66 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Reactions of lead-free solders with CuNi metallizations

Tia‐Marje Korhonen, Peng Su, Sukwon Hong et al. · Journal of Electronic Materials · 2000 · 65 citations

Materials Science, Chemical Engineering, Engineering +6

Stress-migration related electromigration damage mechanism in passivated, narrow interconnects

C.-Y. Li, P. Bo rgesen, Timothy D. Sullivan · Applied Physics Letters · 1991 · 50 citations

Engineering, Passivated Metal Interconnects, Interconnect (Integrated Circuits) +17

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

Sven Rzepka, M. A. Korhonen, E. Meusel et al. · Journal of Electronic Packaging · 1998 · 48 citations

Engineering, Flip-chip Solder Joints, Underfill Delamination +19

A damage integral approach to thermal fatigue of solder joints

R. Subrahmanyan, J. R. Wilcox, C.-Y. Li · Proceedings., 39th Electronic Components Conference · 2003 · 47 citations

Engineering, Mechanical Engineering, Fatigue Damage Rate +17