Reactions of lead-free solders with CuNi metallizations

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

Natural Sciences, Materials Engineering, Materials Science +16

Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu

H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters · 1995 · 193 citations

Natural Sciences, Materials Engineering, Materials Science +17

Rate of consumption of Cu in soldering accompanied by ripening

H. K. Kim, K. N. Tu · Applied Physics Letters · 1995 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +12

Reactions of solid copper with pure liquid tin and liquid tin saturated with copper

Akitoshi Hayashi, C. R. Kao, Ya-chun Chang · Scripta Materialia · 1997 · 66 citations

Natural Sciences, Chemistry, Materials Science +7

High Sn solder reaction with Cu metallization

Tao Liu, D. Kim, Denis H. Y. Leung et al. · Scripta Materialia · 1996 · 24 citations

Engineering, Materials Engineering, Materials Science +14