Concepedia

Solderability

Solderability is a material property that characterizes the ability of an electroless-plated surface to form a metallurgical bond with molten solder under specified conditions, distinguished by the interfacial reactivity and wetting behavior unique to the plated deposit.

1.3K

Publications

54.5K

Citations

3.2K

Authors

691

Institutions

Publications per year

2017–2026

254

Parents

Publications

1.3K

Lead-free Solders in Microelectronics

Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports · 2000 · 2K citations

, , +9

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

, , +10

Controlled Collapse Reflow Chip Joining

Lincoln Miller · IBM Journal of Research and Development · 1969 · 364 citations

, , +14

Physics and materials challenges for lead-free solders

K. N. Tu, Andriy Gusak, M. Li · Journal of Applied Physics · 2003 · 356 citations

, , +17

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

, , +10

1–5 of 1.3K

Authors

3.2K

  1. SJ
    Seung‐Boo Jung

    Sungkyunkwan University, South Korea

    41 publications · 1.5K citations

    24

    h-index

  2. JY
    Jeong‐Won Yoon

    Sungkyunkwan University, South Korea

    30 publications · 1.1K citations

    20

    h-index

  3. CH
    Cheng–En Ho

    Yuan Ze University, Taiwan

    21 publications · 1.5K citations

    19

    h-index

  4. CR
    C. R. Kao

    National Taiwan University, Taiwan

    22 publications · 1.9K citations

    19

    h-index

  5. YC
    Y.C. Chan

    City University of Hong Kong, Hong Kong SAR China

    25 publications · 977 citations

    19

    h-index

1–5 of 3.2K

Institutions

691

  1. City University of Hong Kong

    Hong Kong, Hong Kong

    32 h-index

    137 publications

    6.9K citations

  2. The University of Osaka

    Osaka, Japan

    28 h-index

    121 publications

    5.9K citations

  3. Sungkyunkwan University

    Seoul, South Korea

    25 h-index

    142 publications

    5K citations

  4. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    23 h-index

    93 publications

    3.8K citations

  5. Nanjing University of Aeronautics and Astronautics

    Nanjing, China

    22 h-index

    148 publications

    5.4K citations

  6. Harbin Institute of Technology

    Harbin, China

    22 h-index

    137 publications

    5.1K citations

  7. Nanyang Technological University

    Singapore, Singapore

    22 h-index

    78 publications

    3.9K citations

  8. National Taiwan University

    Taipei, Taiwan

    20 h-index

    75 publications

    3.3K citations

1–8 of 691

Venues

  1. Journal of Alloys and Compounds

    135 publications · 8K citations

    54

    h-index

  2. Journal of Electronic Materials

    JEM · 205 publications · 7.6K citations

    47

    h-index

  3. 34

    h-index

  4. Microelectronics Reliability

    65 publications · 2.8K citations

    33

    h-index

  5. Materials Science and Engineering A

    40 publications · 2.1K citations

    28

    h-index

1–5