Cheng–En Ho

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 324 citations

Materials Science, Materials Engineering, Chemical Engineering +8

Interfacial reaction issues for lead-free electronic solders

Cheng–En Ho, Shenghao Yang, C. R. Kao · Journal of Materials Science Materials in Electronics · 2006 · 272 citations

Materials Science, Electrical Engineering, Engineering +6

Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders

W. T. Chen, Cheng–En Ho, C. R. Kao · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 208 citations

Materials Engineering, Materials Science, Interfacial Reactions +8

Effects of limited cu supply on soldering reactions between SnAgCu and Ni

Cheng–En Ho, You-Cian Lin, Shenghao Yang et al. · Journal of Electronic Materials · 2006 · 143 citations

Materials Engineering, Materials Science, Engineering +5

Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Cheng–En Ho, Ruixiao Zheng, Gan Luo et al. · Journal of Electronic Materials · 2000 · 121 citations

Materials Science, Materials Engineering, Engineering +6