Y. L. Lin

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

Natural Sciences, Materials Engineering, Materials Science +13

Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations

Wei‐Chen Luo, Cheng–En Ho, Jang‐Zern Tsai et al. · Materials Science and Engineering A · 2005 · 118 citations

Natural Sciences, Materials Engineering, Materials Science +12

Electromigration-induced failure in flip-chip solder joints

Yuan Lin, Cheng‐Hsien Tsai, Yu Hu et al. · Journal of Electronic Materials · 2005 · 97 citations

Engineering, Electrical Engineering, Materials Engineering +12

Strong Effect of Cu Concentration on the Reaction between Lead-Free Microelectronic Solders and Ni

Cheng–En Ho, Y. L. Lin, C. R. Kao · Chemistry of Materials · 2002 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +14

Local melting induced by electromigration in flip-chip solder joints

Cheng‐Hsien Tsai, Y. L. Lin, Jang‐Zern Tsai et al. · Journal of Electronic Materials · 2006 · 60 citations

Engineering, Electrical Engineering, Materials Engineering +11