Yuan Lin - Concepedia

Author

Yuan Lin

National Central University ORCID

Also Known As

Lin, Yu-An, Y Lin, Y. H. Lin, Y.H. Lin, Yeqianqian Lin, Yingxu Lin, Yo Hsien Lin, Yu-An Lin, Yuan Horng Lin, Yuan Lin

Publications

635

Citations

H-Index

Concepts

All Affiliations

National Central University Peking University University of California, Los Angeles University of North Carolina at Chapel Hill MingDao University

About

Yuan Lin is an author at National Central University specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	6	6	427
2	Business	2	2	25
3	Management	2	2	25
4	Applied Physics	2	2	112
5	Medicine	1	1	22

Yuan Lin

Publications

580

Citations

H-Index

Page 1

	Year	Citations
In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Yuan Lin, Yu Hu, Cheng‐Hsien Tsai, Acta Materialia Materials ScienceEngineeringMechanical EngineeringSitu ObservationSolder Joints	2005	147
Electromigration failure in flip chip solder joints due to rapid dissolution of copper Yu Hu, Yuan Lin, C. R. Kao, Journal of materials research/Pratt's guide to venture capital sources Materials ScienceElectromigration TechniqueEngineeringCorrosionChip On Board	2003	135
SAFE-clustering: Single-cell Aggregated (from Ensemble) clustering for single-cell RNA-seq data Yuchen Yang, Ruth Huh, Houston Culpepper, Bioinformatics	2018	129
Electromigration-induced failure in flip-chip solder joints Yuan Lin, Cheng‐Hsien Tsai, Yu Hu, Journal of Electronic Materials Electrical EngineeringElectromigration TechniqueEngineeringHardware ReliabilityApplied Physics	2005	96
SAFE-clustering: Single-cell Aggregated (From Ensemble) Clustering for Single-cell RNA-seq Data Yuchen Yang, Ruth Huh, Houston Culpepper, Abstract MotivationEngineeringSingle CellsMultiomicsTranscriptomics Technology	2017	22
Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Y. L. Lin, Wei‐Chen Luo, Yuan Lin, Journal of Electronic Materials Materials ScienceGold ThicknessFriction WeldingEngineeringFlip-chip Solder Joints	2004	16
Using fuzzy DEMATEL to develop a causal and effect model of hot spring service quality expectation C.C. Chen, Ming‐Lang Tseng, Yuan Lin Total Quality ManagementCustomer SatisfactionFuzzy Dematel MethodBusiness IntelligenceService Assurance	2008	14
Evaluation of Worker Productivity Improvement Using ISM and FAHP Yihong Cheng, Anthony S.F. Chiu, Ming‐Lang Tseng, Total Quality ManagementEngineeringFuzzy ModelingIndustrial EngineeringProductivity Management	2007	11
A multiplexable microfluidic injector for versatile encoding of droplets Johnson Q. Cui, Bin‐Bin Cui, Frank X. Liu, Sensors and Actuators B Chemical	2022	10

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