Yuan Lin

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Yuan Lin, Yu Hu, Cheng‐Hsien Tsai et al. · Acta Materialia · 2005 · 147 citations

Materials Science, Engineering, Mechanical Engineering +6

Electromigration failure in flip chip solder joints due to rapid dissolution of copper

Yu Hu, Yuan Lin, C. R. Kao et al. · Journal of materials research/Pratt's guide to venture capital sources · 2003 · 135 citations

Materials Science, Electromigration Technique, Engineering +6

SAFE-clustering: Single-cell Aggregated (from Ensemble) clustering for single-cell RNA-seq data

Yuchen Yang, Ruth Huh, Houston Culpepper et al. · Bioinformatics · 2018 · 129 citations · Full text

Electromigration-induced failure in flip-chip solder joints

Yuan Lin, Cheng‐Hsien Tsai, Yu Hu et al. · Journal of Electronic Materials · 2005 · 96 citations

Electrical Engineering, Electromigration Technique, Engineering +6

SAFE-clustering: Single-cell Aggregated (From Ensemble) Clustering for Single-cell RNA-seq Data

Yuchen Yang, Ruth Huh, Houston Culpepper et al. · 2017 · 22 citations · Full text

Abstract Motivation, Engineering, Single Cells +20