Electromigration-induced failure in flip-chip solder joints - Concepedia

Concepedia

Publication | Closed Access

Electromigration-induced failure in flip-chip solder joints

96

Citations

7

References

2005

Year

Yuan Lin, Cheng‐Hsien Tsai, Yu Hu, Y. L. Lin, C. R. Kao

Journal of Electronic Materials

Electrical EngineeringElectromigration TechniqueEngineeringHardware ReliabilityApplied PhysicsElectromigration-induced FailureChip AttachmentElectronic PackagingMicroelectronics

References

	Year	Citations

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